IEEE Transactions on Consumer Electronics
Information
Impact factor: 4.414 (2021)
ISSN: 0098-3063
Four issues are published in the IEEE Transactions on Consumer Electronics publishes four issues each year. Previous issues can be found at the Xplore site.
In compliance with IEEE, the speed of review and decision for a submitted manuscript will be reviewed using the two indicators (1) S21D (average weeks submitted to 1st decision) and (2) S2OP (average weeks submitted to online post).
The TCE team will exercise full effort to aim at the following targets:
S21D ≤ 10 wks
S2OP ≤ 24 wks
Scope
The IEEE Transactions on Consumer Electronics (TCE) focuses on engineering and research aspects of the electronics, communications and controls, informatics, infotainment, computational intelligence, systems and services, product safety and standardizations for consumer products, technologies and users. TCE covers the theory, innovative development methods, practical implementation, R&D trends, standard use cases, regulatory issues and best practices for consumer applications. The transaction features State-Of-the-Art papers (SoA), case studies of standards, literature reviews, curiosity-driven research, technical innovations, creative ideas, pragmatic consumer practitioners appreciations, key insights and tutorial surveys, etc.
Topics of TCE
IEEE Transactions on Consumer Electronics topics include, but are not limited to, the followings:
Application-Specific CE for Smart Cities (SMC)
Audio/Video Systems and Signal Processing (AVS)
Automotive CE Applications (CEA)
Consumer Power and Energy (CPE)
Consumer Systems for Healthcare and Wellbeing (CSH)
Entertainment and Gaming (ENT)
Human-Machine Interaction and User Experience (HMI)
Internet of Things, Internet of Everywhere and Edge Computing (IOT)
Machine learning, Deep learning and AI in CE (MDA)
Quantum in Consumer Technology (QCT)
Security and Privacy of CE Hardware and Software Systems (SPC)
Smartphone and Mobile Device Technologies (MDT)
Virtual Reality, Augmented Reality and Displays (VAR)
Wireless and Network Technologies (WNT)
Author instructions
l To submit a manuscript, at least one of the authors must present a valid ORCID.
l ScholarOne is the sole way to submit the manuscript
l Authors should use the electronic template from IEEE template selector to prepare their paper. A template for SOA can be found here. The IEEE Author Center can be helpful in providing guidance to authors.
l Authors may upload up to 2TB of data related to their article to IEEE DataPort at no cost (or at low cost if the dataset must be Open Access). Providing data with your article can strengthen your submission and make your research more easily reproducible. Authors can provide the DOI and title of their dataset during the manuscript submission in ScholarOne. Use this link to access IEEE DataPort.
l Only the camera-ready PDF files are needed from authors for their first submission. The source materials (Word, Latex, etc) will be required after the manuscript has been accepted.
l This journal does not accept manuscripts with commercial names, part numbers, or trademark phrases.
l Authors need to supplement sufficient descriptions of the relationship between their contributions to Consumer Technologies/Electronics in their manuscripts. Otherwise, the manuscript will be admin rejected.
l The similarity (i.e., the percentage), excluding the part from bibliographies and biographies, must be no more than 30%.
l The maximum file size is limited to 40MB.
l When the manuscript is accepted, a receipt e-mail with information on how to complete the mandatory IEEE Copyright Transfer & Export Control Form will be sent to authors.
l The biographies for all authors of an accepted manuscript MUST be included.
l The maximum length is 12 pages for technical paper, and 20 pages for survey paper (effective since September 20, 2022). Besides, if the manuscript exceeds 8 pages (for both regular and "Special Section" papers in TCE), $ 250 will be charged per extra page by IEEE. For instance, If your manuscript has 12 pages finally, $1000 will be charged.
l English Editing Services are provided and recommended for non-native speakers to improve the paper quality if necessary.
Please contact the EiC, Kim-Fung Tsang at kf.tce.eic@gmail.com and copy tce.eic.assistant2@gmail.com in case authors have questions related to the submission or the review process of the manuscript.
*For speedy publication purpose, and with the consent of GEs of the corresponding SS, the Editor-in-Chief may post special section papers to regular paper track
Policies and guidelines
1) IEEE Peer Review Policy
The manuscripts to the IEEE TCE are peer reviewed in compliance with the IEEE PSPB Operations Manual's standards (sections 8.2.1.C & 8.2.2.A). Each submitted manuscript will be reviewed by at least THREE (3) independent reviewers through single-blind peer review process.
2) IEEE Copyright Policy
Authors must sign a digital version of the IEEE Copyright Form upon acceptance of the paper to conform with the United States Copyright Law. After the manuscript is accepted, authors will be instantly led to the eCF (electronic Copyright Form).
3) IEEE Plagiarism Policy
It includes THREE (3) statement that deals with multiple submissions or publications of the same work; plagiarism; and electronic posting of papers on author websites. Authors are responsible for understanding, complying with these policies, and acknowledging them when submitting. Failure to comply with these policies may lead to penalties for future publication in IEEE venues.
4) Article Processing Charges Waiver Policy
Open access APCs are waived or lowered for corresponding authors from low-income countries.
5) IEEE Author Center
The IEEE Author Centercan be helpful in providing guidance to authors, where instructions such as ORCID registration and IEEE Style Manual could be found.
Other policies
Special Section
lSpecial Section Proposal Template
lSpecial Section Call-For-Paper Template
Call for Special Section(s) Application:
TCE is standing at the forefront of enabling technologies for consumer technology/electronics, and would like to call for curiosity driven, nature inspired research topics for Special Section proposals. Potential authors and authors are welcome to propose creative topics. Topics of interest may include but not limited to the followings:
- Metaverse related consumer electronics/technologies;
- Quantum computing consumer games and electronics;
- Nature inspired consumer applications;
- risks and cyber threat analysis for consumer applications;
Ongoing Special Section(s):
Special Section: Consumer Electronics in The Era of The Internet of Everything (IoE) And Massive Data: ends on March 1, 2023 May 1, 2023
Special Section: Artificial Intelligence-empowered Internet of Things for Human-Centric Consumer Applications: ends on March 15, 2023 May 15, 2023
Special Section: Federated Learning for Personalized Recommendation of Consumer Electronics: ends on April 30, 2023 May 30, 2023
Special Section: Intelligent Computing for Big Data in Consumer Internet of Things: ends on April 30, 2023 June 30, 2023
Special Section: Consumer-Centric Sustainable and Resilient Technologies for Industry 5.0: ends on June 1, 2023 August 1, 2023
Special Section: Data-Driven Innovation and Adversarial Learning Models for Industry 5.0 towards Consumer Digital Ecosystems: ends on June 1, 2023 August 1, 2023
Special Section: Customers Centric Communication and Networked Control for Intelligent Cyber-Physical Transportation Systems: ends on June 30, 2023
Special Section: Emerging Technologies and Applications of Consumer Electronics for Healthy and Sustainable Life: ends on June 30, 2023
Special Section Metaverse and Digital Twins for Consumer Electronics: ends on July 30, 2023
Special Section: Tactile Internet for Consumer Internet of Things Opportunities and Challenges: ends on July 30, 2023
Special Section: Smart Data Driven Modeling for Emerging Customer Applications in Mobile Edge Computing: ends on July 30, 2023
Special Section: Advanced Learning Intelligence in Quantum-Enabled Consumer Applications: ends on August 30, 2023
Special Section: Security and Privacy of Multimedia and Multimodal Data for Consumers Electronic Applications: ends on August 30, 2023
Special Section: Distributed and Resilient Machine Learning towards Trustworthy Sustainable Next-G Consumer Electronics: ends on August 30, 2023
Completed Special Section(s):
Special Section: Consumer Electronics with Artificial Intelligence – Part I: completed on September 15, 2022 October 15, 2022
Special Section: Multimedia Sensing and Computing for Consumer Electronics: completed on November 1, 2022
Special Section: Human Signal Processing for Health Based Consumer Electronics: completed on November 1, 2022
Special Section: Neural Computing-driven Artificial Intelligence for Consumer Electronics: completed on November 1, 2022
Special Section: Complex Network Analysis and Applications in Next-Generation Consumer Electronics: ends on October 31, 2022 December 31, 2022
Special Section: Network Automation for Consumer Internet-of-Things in Smart Healthcare: ends on November 30, 2022 January 31, 2023
Special Section: Consumer Technologies in System Biology and Biomedical Systems: ends on December 1, 2022 February 1, 2023
Special Section: DENSE - Data Integrity, Integration and Security Issues for Consumer Data in Industry 5.0: ends on December 1, 2022 February 1, 2023
Special Section: Security, Privacy and Trust for Consumer Smart Devices: ends on December 15, 2022 February 15, 2023
Special Section: Graph-powered Intelligent Data Processing for Consumer Electronics: ends on January 1, 2023 March 1, 2023
Special Section: Smart Home Energy Management based on Consumer Electronics: ends on January 1, 2023 March 1, 2023
Special Section: Improving Safety and Reliability of Artificial Intelligence in Consumer Electronics: ends on February 1, 2023
Editorial Board |
Editor-In-Chief |
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Dr. Kim-Fung Tsang City University of Hong Kong |
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Senior Editors |
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Prof. Jong-Moon Chung
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Prof. Fabrizio Lamberti
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Prof. Shahriar Mirabbasi
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Prof. Fumitaka Ono
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Yonsei University
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Politecnico di Torino
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Sharif University of
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Tokyo Polytechnic
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***Associate Editors |
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| Prof. Chih-Peng Fan | Prof. Yu-Cheng Fan | Prof. Brij B. Gupta | Dr. Alireza Jolfaei | |
| National Chung Hsing University |
National Taipei University of Technology |
Asia University | Flinders University | |
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| Prof. Srinivas Katkoori | Prof. Wing-Kuen Ling | Prof. Shahid Mumtaz | Prof. Sangheon Pack | |
| University of South Florida |
Guangdong University of Technology |
Instituto de Telecomunicaçõces |
Korea University | |
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| Prof. Ayman Radwan | Prof. Sreeraman Rajan | Prof. Ruck Thawonmas | Dr. Himanshu Thapliyal | |
| University of Aveiro | Carleton University | Ritsumeikan University | The University of Tennessee, Knoxville |
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| Prof. Haijun Zhang | ||||
| Harbin Institute of Technology |
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Prof. Fernando Pescador
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Prof. Simon Sherratt
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Wayne Luplow
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Universidad Politécnica
de Madrid |
University of Reading
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Zenith R&D Laboratory,
LG Electronics
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| 2017-2021 | 2011-2016 | 1975-2011 | |