IEEE Transactions on Consumer Electronics

Information

Impact factor: 2.947(2020)

ISSN: 0098-3063

Four issues are published in the IEEE Transactions on Consumer Electronics publishes four issues each year. Previous issues can be found at the Xplore site .

In compliance with IEEE, the speed of review and decision for a submitted manuscript will be reviewed using the two indicators(1) S21D (average weeks submitted to 1st decision) and (2) S2OP (average weeks submitted to online post).

The TCE team will exercise full effort to aim at the following targets:

S21D 10 wks

S2OP 24 wks

Scope

The IEEE Transactions on Consumer Electronics (TCE) focuses on engineering and research aspects of the electronics, communications and controls, informatics, infotainment, computational intelligence, systems and services, product safety and standardizations for consumer products, technologies and users. TCE covers the theory, innovative development methods, practical implementation, R&D trends, standard use cases, regulatory issues and best practices for consumer applications. The transaction features State-Of-the-Art papers (SoA), case studies of standards, literature reviews, curiosity-driven research, technical innovations, creative ideas, pragmatic consumer practitioners appreciations, key insights and tutorial surveys, etc.

Topics of TCE

IEEE Transactions on Consumer Electronics topics include, but are not limited to, the followings:

Ÿ   Application-Specific CE for Smart Cities (SMC)

Ÿ   Audio/Video Systems and Signal Processing (AVS)

Ÿ   Automotive CE Applications (CEA)

Ÿ   Consumer Power and Energy (CPE)

Ÿ   Consumer Systems for Healthcare and Wellbeing (CSH)

Ÿ   Entertainment and Gaming (ENT)

Ÿ   Human-Machine Interaction and User Experience (HMI)

Ÿ   Internet of Things, Internet of Everywhere and Edge Computing (IOT)

Ÿ   Machine learning, Deep learning and AI in CE (MDA)

Ÿ   Quantum in Consumer Technology (QCT)

Ÿ   Security and Privacy of CE Hardware and Software Systems (SPC)

Ÿ   Sensors and Actuators (SEA)

Ÿ   Smartphone and Mobile Device Technologies (MDT)

Ÿ   Virtual Reality, Augmented Reality and Displays (VAR)

Ÿ   Wireless and Network Technologies (WNT)

Author instructions

l  To submit a manuscript, at least one of the authors must present a valid ORCID.

l  Scholar One is the sole way to submit the manuscript

l  Authors should use the electronic template from IEEE template selector to prepare their paper.A template for SOA can be found here: IEEE TCE_SoA_20220310_KF1. The IEEE Author Centercan be helpful in providing guidance to authors.

l  Only the camera-ready PDF files are needed from authors for their first submission. The source materials (Word, Latex, etc) will be required after the manuscript has been accepted.

l  This journal does not accept manuscripts with commercial names, part numbers, or trademark phrases.

l  The similarity (i.e., the percentage), excluding the part from bibliographies and biographies,must be no more than  30%.

l  The maximum file size is limited to 40MB.

l  When the manuscript is accepted, a receipt e-mail with information on how to complete the mandatory IEEE Copyright Transfer & Export Control Form will be sent to authors.

l  All papers can only have a maximum of 8 printed pages, and papers with more than 8 pages will incur a fee of $250 per page.

l  English Editing Services are provided and recommended for non-native speakers to improve the paper quality if necessary.

Please contact the EiC, Kim-Fung Tsang at kf.tce.eic@gmail.com in case authors have questions related to the submission or the review process of the manuscript.

Policies and guidelines

1)      IEEE Peer Review Policy

The manuscripts to the IEEE TCE are peer reviewed in compliance with the IEEE PSPB Operations Manual's standards (sections 8.2.1.C & 8.2.2.A). Each submitted manuscript will be reviewed by at least THREE (3) independent reviewers through single-blind peer review process.

2)      IEEE Copyright Policy

Authors must sign a digital version of the IEEE Copyright Form upon acceptance of the paper to conform with the United States Copyright Law. After the manuscript is accepted, authors will be instantly led to the eCF (electronic Copyright Form).

3)      IEEE Plagiarism Policy

It includes THREE (3) statement that deals with multiple submissions or publications of the same work; plagiarism; and electronic posting of papers on author websites. Authors are responsible for understanding, complying with these policies, and acknowledging when submission. Failure to comply with these policies may lead to penalties on future publication in IEEE venues.

4)      Article Processing Charges Waiver Policy

Open access APCs are waived or lowered for corresponding authors from low-income countries.

5)      IEEE Author Center

The IEEE Author Centercan be helpful in providing guidance to authors, where instructions such as ORCID registration and IEEE Style Manual could be found.

Other guidelines

l  Associate Editor guidelines: IEEE TCE_Guideline for AE_20220329_KF2

l  Apply for Associate Editor:  IEEE TCE  Associate Editor form_20220209_V2

l  Apply for Senior Editor: IEEE TCE  Senior Editor form_20220209_V1

Special Section

l  Information of Special Sections: IEEE TCE Special Section instructions_20220310_KF1

l  Guest Editor (GE) Information Form:  IEEE TCE  Guest Editor form_20220209_V1

Editorial Board

Editor-In-Chief

KFTsang

Dr. Kim-Fung Tsang

City University of Hong Kong

 

 

 

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Senior Editors

JMChung
Fabrizio
Shahriar Mirabbasi
Prof. Fumitaka Ono
Prof. Jong-Moon Chung
Prof. Fabrizio Lamberti
Prof. Shahriar Mirabbasi
Prof. Fumitaka Ono
Yonsei University
Politecnico di Torino
Sharif University of
Technology
Tokyo Polytechnic
University
       
 Prof. Chih Peng Fan  Prof. Yu Cheng Fan  Prof. Brij B. Gupta  Dr. Alireza Jolfaei
 Prof. Chih-Peng Fan  Prof. Yu-Cheng Fan  Prof. Brij B. Gupta  Dr. Alireza Jolfaei
 National Chung Hsing
University
National Taipei University  
of Technology 
Asia University  Flinders University 
       
 Prof. Srinivas Katkoori 1  Prof. Wing Kuen Ling  Prof. Shahid Mumtaz  Prof. Sangheon Pack
 Prof. Srinivas Katkoori  Prof. Wing-Kuen Ling  Prof. Shahid Mumtaz  Prof. Sangheon Pack
 University of South
Florida
 Guangdong University of
Technolog
 Instituto de
Telecomunicaçõces
 Korea University
       
 Dr. Alvaro Quevedo  Prof. Ayman Radwan  Prof. SreeramanRajann  Prof. Ruck Thawonmas
 Dr. Alvaro Quevedo  Prof. Ayman Radwan  Prof. Sreeraman Rajan  Prof. Ruck Thawonmas
 Universidad M. Nueva
Granada
 University of Aveiro  Carleton University  Ritsumeikan University
       
 Dr. Himanshu Thapliyal  Prof. Haijun Zhang    
 Dr. Himanshu Thapliyal  Prof. Haijun Zhang    
 The University of
Tennessee, Knoxville
Harbin Institute of
Technology

 

   

 

 

 

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Past Editors

Fernando
Simon S
WayneL
 
Prof. Fernando Pescador
Prof. Simon Sherratt
Wayne Luplow
 
Universidad Politécnica
de Madrid
University of Reading
Zenith R&D Laboratory,
LG Electronics
 
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