IEEE Transactions on Consumer Electronics


Impact factor: 4.300 (2022)

ISSN: 0098-3063

Four issues are published in the IEEE Transactions on Consumer Electronics publishes four issues each year. Previous issues can be found at the Xplore site.

In compliance with IEEE, the speed of review and decision for a submitted manuscript will be reviewed using the two indicators (1) S21D (average weeks submitted to 1st decision) and (2) S2OP (average weeks submitted to online post).

The TCE team will exercise full effort to aim at the following targets:

S21D 10 wks

S2OP 24 wks


The IEEE Transactions on Consumer Electronics (TCE) focuses on engineering and research aspects of the electronics, communications and controls, informatics, infotainment, computational intelligence, systems and services, product safety and standardizations for consumer products, technologies and users. TCE covers the theory, innovative development methods, practical implementation, R&D trends, standard use cases, regulatory issues and best practices for consumer applications. The transaction features State-Of-the-Art papers (SoA), case studies of standards, literature reviews, curiosity-driven research, technical innovations, creative ideas, pragmatic consumer practitioners appreciations, key insights and tutorial surveys, etc.

Topics of TCE

IEEE Transactions on Consumer Electronics topics include, but are not limited to, the followings:

Ÿ   Application-Specific CE for Smart Cities (SMC)

Ÿ   Audio/Video Systems and Signal Processing (AVS)

Ÿ   Automotive CE Applications (CEA)

Ÿ   Consumer Power and Energy (CPE)

Ÿ   Consumer Systems for Healthcare and Wellbeing (CSH)

Ÿ   Entertainment and Gaming (ENT)

Ÿ   Human-Machine Interaction and User Experience (HMI)

Ÿ   Internet of Things, Internet of Everywhere and Edge Computing (IOT)

Ÿ   Machine learning, Deep learning and AI in CE (MDA)

Ÿ   Quantum in Consumer Technology (QCT)

Ÿ   Security and Privacy of CE Hardware and Software Systems (SPC)

Ÿ   Sensors and Actuators (SEA)

Ÿ   Smartphone and Mobile Device Technologies (MDT)

Ÿ   Virtual Reality, Augmented Reality and Displays (VAR)

Ÿ   Wireless and Network Technologies (WNT)

Author instructions

l  To submit a manuscript, at least one of the authors must present a valid ORCID.

l  ScholarOne is the sole way to submit the manuscript

l  Authors should use the electronic template from IEEE template selector to prepare their paper. A template for SOA can be found here. The IEEE Author Center can be helpful in providing guidance to authors.

l  Authors may upload up to 2TB of data related to their article to IEEE DataPort at no cost (or at low cost if the dataset must be Open Access).  Providing data with your article can strengthen your submission and make your research more easily reproducible. Authors can provide the DOI and title of their dataset during the manuscript submission in ScholarOne. Use this link to access IEEE DataPort.

l  Only the camera-ready PDF files are needed from authors for their first submission. The source materials (Word, Latex, etc) will be required after the manuscript has been accepted.

l  This journal does not accept manuscripts with commercial names, part numbers, or trademark phrases.

l  Authors need to supplement sufficient descriptions of the relationship between their contributions to Consumer Technologies/Electronics in their manuscripts. Otherwise, the manuscript will be admin rejected.

l  The similarity (i.e., the percentage), excluding the part from bibliographies and biographies, must be no more than  30%.

l  The maximum file size is limited to 40MB.

l  When the manuscript is accepted, a receipt e-mail with information on how to complete the mandatory IEEE Copyright Transfer & Export Control Form will be sent to authors.

l  The biographies for all authors of an accepted manuscript MUST be included. 

l  The recommended maximum length is 12 pages for technical paper, and 20 pages for survey paper (effective since September 20, 2022). Besides, if the manuscript exceeds 8 pages (for both regular and "Special Section" papers in TCE), 250 USD will be charged per extra page by IEEE. For instance, If your manuscript has 12 pages finally, 1000 USD will be charged.

l  English Editing Services are provided and recommended for non-native speakers to improve the paper quality if necessary.

TCE invites state-of-the-art research to be submitted as "Invited Paper". Authors may self-nominate. Please write to to notify the Editor-in-Chief of your submission.

Please contact the EiC, Kim-Fung Tsang at and copy in case authors have questions related to the submission or the review process of the manuscript.

*For speedy publication purpose, and with the consent of GEs of the corresponding SS, the Editor-in-Chief may post special section papers to regular paper track

Policies and guidelines

1)      IEEE Peer Review Policy

The manuscripts to the IEEE TCE are peer reviewed in compliance with the IEEE PSPB Operations Manual's standards (sections 8.2.1.C & 8.2.2.A). Each submitted manuscript will be reviewed by at least THREE (3) independent reviewers through single-blind peer review process.

2)      IEEE Copyright Policy

Authors must sign a digital version of the IEEE Copyright Form upon acceptance of the paper to conform with the United States Copyright Law. After the manuscript is accepted, authors will be instantly led to the eCF (electronic Copyright Form).

3)      IEEE Plagiarism Policy

It includes THREE (3) statement that deals with multiple submissions or publications of the same work; plagiarism; and electronic posting of papers on author websites. Authors are responsible for understanding, complying with these policies, and acknowledging them when submitting. Failure to comply with these policies may lead to penalties for future publication in IEEE venues.

4)      Article Processing Charges Waiver Policy

Open access APCs are waived or lowered for corresponding authors from low-income countries.


 5)      IEEE Author Center

The IEEE Author Centercan be helpful in providing guidance to authors, where instructions such as ORCID registration and IEEE Style Manual could be found.

Other policies

l  Apply for Associate Editor

l  Apply for Senior Editor

Special Section

l  Special Section Guidelines 

lSpecial Section Proposal Template

l  Guest Editor (GE) Form A 

l  Guest Editor (GE) Form B

lSpecial Section Call-For-Paper Template


Call for Special Section(s) Application:

TCE is standing at the forefront of enabling technologies for consumer technology/electronics, and would like to call for curiosity driven, nature inspired research topics for Special Section proposals. Potential authors and authors are welcome to propose creative topics. Topics of interest may include but not limited to the followings:

- Metaverse related consumer electronics/technologies; 

- Quantum computing consumer games and electronics; 

- Nature inspired consumer applications;

- risks and cyber threat analysis for consumer applications;


Ongoing Special Section(s):

Special Section Metaverse and Digital Twins for Consumer Electronics: ends on July 30, 2023 September 30, 2023

Special Section: Smart Data Driven Modeling for Emerging Customer Applications in Mobile Edge Computing: ends on July 30, 2023 September 30, 2023

Special Section: Advanced Learning Intelligence in Quantum-Enabled Consumer Applications: ends on August 30, 2023 October 31, 2023

Special Section: Security and Privacy of Multimedia and Multimodal Data for Consumers Electronic Applications: ends on August 30, 2023 October 31, 2023

Special Section: Split Learning in Consumer Electronics for Smart Cities: Theories, Tools, Applications and Challenges: ends on September 30, 2023

Special Section: Generative Artificial Intelligence with Applications on Consumer Electronics: ends on September 30, 2023

Special Section: Neuromorphic Computing Technologies for Consumer Electronics: ends on September 30, 2023

Special Section: Digital Twin and Metaverse for Consumer Health (MCH): ends on October 30, 2023

Special Section: Secure Artificial Intelligence in 6G Consumer Electronics:ends on October 30, 2023

Special Section: Sustainability of Consumer Electronics Safety, Security and Energy Efficiency: ends on October 30, 2023

Special Section: AI-Generated Content for Consumer Electronics: ends on November 30, 2023

Special Section: Consumer-driven energy-efficient WSNs architecture for Personalization and contextualization in E-commerce Systems: ends on November 30, 2023

Special Section: Blockchain-assisted 6G Communication in Consumer Electronics Applications, Challenges and Opportunities: ends on November 30, 2023

Special Section: Multimodal Data-Driven Decision-Making for Next-Generation Consumer Electronics: ends on November 30, 2023

Special Section: Digital Twin Technology for Sustainable Manufacturing of Consumer Electronics: ends on December 31, 2023

Special Section: Opportunities and Challenges for Consumer Electronics and Metaverse Integration: ends on December 31, 2023

Special Section: VIRUS - GeneratiVe AI FoR Sustainable, Ethical, and Privacy Preserved ConsUmer Space- Opportunities, Challenges and Future Research Directions: ends on December 31, 2023




Completed Special Section(s):

Special Section: Consumer Electronics with Artificial Intelligence – Part I: completed on September 15, 2022 October 15, 2022

Special Section: Multimedia Sensing and Computing for Consumer Electronics: completed on November 1, 2022

Special Section: Human Signal Processing for Health Based Consumer Electronics: completed on November 1, 2022

Special Section: Neural Computing-driven Artificial Intelligence for Consumer Electronics: completed on November 1, 2022

Special Section: Complex Network Analysis and Applications in Next-Generation Consumer Electronics: ends on October 31, 2022 December 31, 2022

Special Section: Network Automation for Consumer Internet-of-Things in Smart Healthcare: ends on November 30, 2022 January 31, 2023

Special Section: Consumer Technologies in System Biology and Biomedical Systems: ends on December 1, 2022 February 1, 2023

Special Section: DENSE - Data Integrity, Integration and Security Issues for Consumer Data in Industry 5.0: ends on December 1, 2022 February 1, 2023

Special Section: Security, Privacy and Trust for Consumer Smart Devices: ends on December 15, 2022 February 15, 2023

Special Section: Graph-powered Intelligent Data Processing for Consumer Electronics: ends on January 1, 2023 March 1, 2023

Special Section: Smart Home Energy Management based on Consumer Electronics: ends on January 1, 2023 March 1, 2023

Special Section: Improving Safety and Reliability of Artificial Intelligence in Consumer Electronics: ends on February 1, 2023

Special Section: Consumer Electronics in The Era of The Internet of Everything (IoE) And Massive Data: ends on March 1, 2023 May 1, 2023

Special Section: Artificial Intelligence-empowered Internet of Things for Human-Centric Consumer Applications: ends on March 15, 2023 May 15, 2023

Special Section: Federated Learning for Personalized Recommendation of Consumer Electronics: ends on April 30, 2023 May 30, 2023

Special Section: Intelligent Computing for Big Data in Consumer Internet of Things: ends on April 30, 2023 June 30, 2023

Special Section: Customers Centric Communication and Networked Control for Intelligent Cyber-Physical Transportation Systems: ends on June 30, 2023

Special Section: Consumer-Centric Sustainable and Resilient Technologies for Industry 5.0: ends on June 1, 2023 August 1, 2023

Special Section: Data-Driven Innovation and Adversarial Learning Models for Industry 5.0 towards Consumer Digital Ecosystems: ends on  June 1, 2023 August 1, 2023

Special Section: Tactile Internet for Consumer Internet of Things Opportunities and Challenges: ends on July 30, 2023

Special Section: Emerging Technologies and Applications of Consumer Electronics for Healthy and Sustainable Life: ends on June 30, 2023 August 31, 2023 

Special Section: Distributed and Resilient Machine Learning towards Trustworthy Sustainable Next-G Consumer Electronics: ends on August 30, 2023


Editorial Board



Dr. Kim-Fung Tsang

City University of Hong Kong

Hong Kong





Senior Editors

Shahriar Mirabbasi
Prof. Fumitaka Ono
Prof. Jong-Moon Chung
Prof. Fabrizio Lamberti
Prof. Shahriar Mirabbasi
Prof. Fumitaka Ono
Yonsei University
Politecnico di Torino
Sharif University of
Tokyo Polytechnic
Korea Italy Canada Japan


Associate Editors

 Prof. Chih Peng Fan  Prof. Yu Cheng Fan  Prof. Brij B. Gupta  Dr. Alireza Jolfaei
 Prof. Chih-Peng Fan  Prof. Yu-Cheng Fan  Prof. Brij B. Gupta  Dr. Alireza Jolfaei
 National Chung Hsing
National Taipei University  
of Technology 
Asia University  Flinders University 
Taiwan Taiwan Taiwan Australia
 Prof. Srinivas Katkoori 1  Prof. Wing Kuen Ling  Prof. Shahid Mumtaz  Prof. Sangheon Pack
 Prof. Srinivas Katkoori  Prof. Wing-Kuen Ling  Prof. Shahid Mumtaz  Prof. Sangheon Pack
 University of South
 Guangdong University of
 Instituto de
 Korea University
USA China Portugal Korea
 Prof. Ayman Radwan Prof. SreeramanRajann   Prof. Ruck Thawonmas Dr. Himanshu Thapliyal 
 Prof. Ayman Radwan   Prof. Sreeraman Rajan  Prof. Ruck Thawonmas  Dr. Himanshu Thapliyal
  University of Aveiro Carleton University  Ritsumeikan University  The University of
Tennessee, Knoxville 
 Portugal  Canada  Japan  USA
 Prof. Haijun Zhang Picture1  Picture2 Picture3 
 Prof. Haijun Zhang Dr. Muhammad Ikram Ashraf  Prof. Ali Kashif Bashir Dr. Siqi Bu
Harbin Institute of
 Nokia Bell Labs  Manchester Metropolitan University  The Hong Kong Polytechnic University 
China Finland    UK  Hong Kong  
Picture4 Picture5 Picture6 Picture7
Prof. Lai Hang Leanne Chan Prof. Long Cheng Dr. Hao Ran Chi   Dr. Yuemin Ding
City University of Hong Kong North China Electric Power University Instituto de Telecomunicações  University of Navarra 
Hong Kong  China    Portugal Spain  
Picture8 Picture9 Picture10 Picture11
 Dr. Kazi Huq Dr. Haesik Kim  Dr. Chun Sing Lai Dr. Carman K.M. Lee   
 Ofinno VTT Technical Research Centre of Finland  Brunel University London  The Hong Kong Polytechnic University
USA   Finland   UK   Hong Kong
Picture12 Picture13 Picture14 Picture15
 Dr. Weizhi Meng  Dr. Lucia Pepa  Prof. Arun Kumar Sangaiah  Prof. Lei Shu
Technical University of Denmark Università Politecnica delle Marche National Yunlin University of Science & Technology  Nanjing Agricultural University, China
 Denmark  Italy  Taiwan  University of Lincoln, UK
Picture16 Picture17 Picture18 Picture19
 Dr. Wei Wei  Prof. Zhou Wu  Prof. Hui Xia  Prof. Shen Yin
University of Wollongong, Australia  Chongqing University Ocean University of China Norwegian University of Science and Technology
 Xi'an university of Technology, China  China China Norway
Picture20 Picture21 Picture22  
 Prof. Mingbo Zhao  Dr. Zheng Zhigao Dr. Xiaokang Zhou   
Donghua University Wuhan University Shiga University  
China China Japan  






Former Editors-in-Chief

Simon S
Prof. Fernando Pescador
Prof. Simon Sherratt
Wayne Luplow
Universidad Politécnica
de Madrid
University of Reading
Zenith R&D Laboratory,
LG Electronics
2017-2021   2011-2016 1975-2011