IEEE Transactions on Consumer Electronics


Impact factor: 4.414 (2021)

ISSN: 0098-3063

Four issues are published in the IEEE Transactions on Consumer Electronics publishes four issues each year. Previous issues can be found at the Xplore site.

In compliance with IEEE, the speed of review and decision for a submitted manuscript will be reviewed using the two indicators(1) S21D (average weeks submitted to 1st decision) and (2) S2OP (average weeks submitted to online post).

The TCE team will exercise full effort to aim at the following targets:

S21D 10 wks

S2OP 24 wks


The IEEE Transactions on Consumer Electronics (TCE) focuses on engineering and research aspects of the electronics, communications and controls, informatics, infotainment, computational intelligence, systems and services, product safety and standardizations for consumer products, technologies and users. TCE covers the theory, innovative development methods, practical implementation, R&D trends, standard use cases, regulatory issues and best practices for consumer applications. The transaction features State-Of-the-Art papers (SoA), case studies of standards, literature reviews, curiosity-driven research, technical innovations, creative ideas, pragmatic consumer practitioners appreciations, key insights and tutorial surveys, etc.

Topics of TCE

IEEE Transactions on Consumer Electronics topics include, but are not limited to, the followings:

Ÿ   Application-Specific CE for Smart Cities (SMC)

Ÿ   Audio/Video Systems and Signal Processing (AVS)

Ÿ   Automotive CE Applications (CEA)

Ÿ   Consumer Power and Energy (CPE)

Ÿ   Consumer Systems for Healthcare and Wellbeing (CSH)

Ÿ   Entertainment and Gaming (ENT)

Ÿ   Human-Machine Interaction and User Experience (HMI)

Ÿ   Internet of Things, Internet of Everywhere and Edge Computing (IOT)

Ÿ   Machine learning, Deep learning and AI in CE (MDA)

Ÿ   Quantum in Consumer Technology (QCT)

Ÿ   Security and Privacy of CE Hardware and Software Systems (SPC)

Ÿ   Sensors and Actuators (SEA)

Ÿ   Smartphone and Mobile Device Technologies (MDT)

Ÿ   Virtual Reality, Augmented Reality and Displays (VAR)

Ÿ   Wireless and Network Technologies (WNT)

Author instructions

l  To submit a manuscript, at least one of the authors must present a valid ORCID.

l  ScholarOne is the sole way to submit the manuscript

l  Authors should use the electronic template from IEEE template selector to prepare their paper. A template for SOA can be found here. The IEEE Author Centercan be helpful in providing guidance to authors.

l  Authors may upload up to 2TB of data related to their article to IEEE DataPort at no cost (or at low cost if the dataset must be Open Access).  Providing data with your article can strengthen your submission and make your research more easily reproducible. Authors can provide the DOI and title of their dataset during the manuscript submission in ScholarOne. Use this link to access IEEE DataPort.

l  Only the camera-ready PDF files are needed from authors for their first submission. The source materials (Word, Latex, etc) will be required after the manuscript has been accepted.

l  This journal does not accept manuscripts with commercial names, part numbers, or trademark phrases.

l  Authors need to supplement sufficient descriptions of the relationship between their contributions to Consumer Technologies/Electronics in their manuscripts. Otherwise, the manuscript will be admin rejected.

l  The similarity (i.e., the percentage), excluding the part from bibliographies and biographies, must be no more than  30%.

l  The maximum file size is limited to 40MB.

l  When the manuscript is accepted, a receipt e-mail with information on how to complete the mandatory IEEE Copyright Transfer & Export Control Form will be sent to authors.

l  Please be aware that if your revised manuscript exceeds the page limit (8 pages for regular and "Special Section" papers in TCE), extra page costs will be charged by IEEE ($ 250 per extra page). The maximum length of the manuscript is 12 pages. (This rule will be effective for manuscripts which are  submitted on or after Sept. 20, 2022.)

l  English Editing Services are provided and recommended for non-native speakers to improve the paper quality if necessary.

Please contact the EiC, Kim-Fung Tsang at in case authors have questions related to the submission or the review process of the manuscript.

Policies and guidelines

1)      IEEE Peer Review Policy

The manuscripts to the IEEE TCE are peer reviewed in compliance with the IEEE PSPB Operations Manual's standards (sections 8.2.1.C & 8.2.2.A). Each submitted manuscript will be reviewed by at least THREE (3) independent reviewers through single-blind peer review process.

2)      IEEE Copyright Policy

Authors must sign a digital version of the IEEE Copyright Form upon acceptance of the paper to conform with the United States Copyright Law. After the manuscript is accepted, authors will be instantly led to the eCF (electronic Copyright Form).

3)      IEEE Plagiarism Policy

It includes THREE (3) statement that deals with multiple submissions or publications of the same work; plagiarism; and electronic posting of papers on author websites. Authors are responsible for understanding, complying with these policies, and acknowledging them when submitting. Failure to comply with these policies may lead to penalties for future publication in IEEE venues.

4)      Article Processing Charges Waiver Policy

Open access APCs are waived or lowered for corresponding authors from low-income countries.

 5)      IEEE Author Center

The IEEE Author Centercan be helpful in providing guidance to authors, where instructions such as ORCID registration and IEEE Style Manual could be found.

Other guidelines

l  Senior Editor Guidelines

l  Associate Editor Guidelines

l  Reviewer Guidelines

l  Apply for Associate Editor

l  Apply for Senior Editor

Special Section

l  Special Section Guidelines 

l  Special Section Proposal Template

l  Guest Editor (GE) Form A 

l  Guest Editor (GE) Form B

Ongoing Special Section(s):

Special Section: Consumer Electronics with Artificial Intelligence – Part I: ends on September 15, 2022

Special Section: Complex Network Analysis and Applications in Next-Generation Consumer Electronics: ends on October 31, 2022

Special Section: Multimedia Sensing and Computing for Consumer Electronics: ends on November 1, 2022

Special Section: Human Signal Processing for Health Based Consumer Electronics: ends on November 1, 2022

Special Section: Neural Computing-driven Artificial Intelligence for Consumer Electronics: ends on November 1, 2022

Special Section: Network Automation for Consumer Internet-of-Things in Smart Healthcare: ends on November 31, 2022

Special Section: Consumer Technologies in System Biology and Biomedical Systems: ends on December 1, 2022

Special Section: DENSE - Data Integrity, Integration and Security Issues for Consumer Data in Industry 5.0: ends on December 1, 2022

Special Section: Security, Privacy and Trust for Consumer Smart Devices: ends on December 15, 2022

Special Section: Graph-powered Intelligent Data Processing for Consumer Electronics: ends on January 1, 2023

Special Section: Smart Home Energy Management based on Consumer Electronics: ends on January 1, 2023




Editorial Board



Dr. Kim-Fung Tsang

City University of Hong Kong





Senior Editors

Shahriar Mirabbasi
Prof. Fumitaka Ono
Prof. Jong-Moon Chung
Prof. Fabrizio Lamberti
Prof. Shahriar Mirabbasi
Prof. Fumitaka Ono
Yonsei University
Politecnico di Torino
Sharif University of
Tokyo Polytechnic


Associate Editors

 Prof. Chih Peng Fan  Prof. Yu Cheng Fan  Prof. Brij B. Gupta  Dr. Alireza Jolfaei
 Prof. Chih-Peng Fan  Prof. Yu-Cheng Fan  Prof. Brij B. Gupta  Dr. Alireza Jolfaei
 National Chung Hsing
National Taipei University  
of Technology 
Asia University  Flinders University 
 Prof. Srinivas Katkoori 1  Prof. Wing Kuen Ling  Prof. Shahid Mumtaz  Prof. Sangheon Pack
 Prof. Srinivas Katkoori  Prof. Wing-Kuen Ling  Prof. Shahid Mumtaz  Prof. Sangheon Pack
 University of South
 Guangdong University of
 Instituto de
 Korea University
 Dr. Alvaro Quevedo  Prof. Ayman Radwan  Prof. SreeramanRajann  Prof. Ruck Thawonmas
 Dr. Alvaro Quevedo  Prof. Ayman Radwan  Prof. Sreeraman Rajan  Prof. Ruck Thawonmas
 Universidad M. Nueva
 University of Aveiro  Carleton University  Ritsumeikan University
 Dr. Himanshu Thapliyal  Prof. Haijun Zhang    
 Dr. Himanshu Thapliyal  Prof. Haijun Zhang    
 The University of
Tennessee, Knoxville
Harbin Institute of







Former Editors-in-Chief

Simon S
Prof. Fernando Pescador
Prof. Simon Sherratt
Wayne Luplow
Universidad Politécnica
de Madrid
University of Reading
Zenith R&D Laboratory,
LG Electronics
2017-2021   2011-2016 1975-2011