IEEE Consumer Electronics Magazine

 MCE 2022 vol11 no5 1  

 2021 Journal Citation Reports (JCR) Metrics


  

 

 

 

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  ISSN: 2162-2248

       

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Mission Statement 

To educate, inform, and entertain our community of IEEE Consumer Technology Society (CTSoc) members on technology, events, industry news, and general topics relating to consumer electronics and to further serve and support our Members in professional career development through tutorials and raising awareness of engineering tools and technologies.

We are proud to announce that the IEEE Consumer Electronics Magazine (MCE), January Vol. 2, No. 1, won an Apex Grand Award for excellence in writing.The CE Magazine has been named the winner in the Regional 2016 STC Technical Communication Awards - Award of Excellence! The STC Technical Communication Awards is one of the most coveted award in technical communications. The CE magazine is indexed in Clarivate Analytics (formerly IP Science of Thomson Reuters).The current impact factor of CE magazine is 4.016.

 

Magazine Description

The IEEE Consumer Electronics Magazine (MCE) is the award-winning flagship magazine of the IEEE Consumer Technology Society (CTSoc) IEEE (https://ctsoc.ieee.org/publications/ieee-consumer-electronics-magazine.html). The magazine is published on a bimonthly basis and features a range of topical content on state-of-art consumer electronics systems, services and devices and associated technologies. Following is the persistent link of IEEE-MCE at the IEEEXplore: http://ieeexplore.ieee.org/servlet/opac?punumber=5962380.

The Magazine features regular sections devoted to standards, patents & IP matters, security & digital content, device tear-downs and reviews of books and engineering software & design tools. If you are interested in contributing please contact the Editor-in-Chief (EiC) Assoc. Prof. Norbert Herencsar at ieee.mce.eic@gmail.com for feedback and to discuss the suitability of your ideas for an article.

ScholarOne Manuscripts URL for the submission of the manuscripts to IEEE-MCE is the following: http://mc.manuscriptcentral.com/cemag

 

Aims and Scope

The scope of the IEEE Consumer Electronics Magazine covers the following areas that are related to “consumer electronics and technologies” and other topics considered of interest to consumer electronics: Video technology, Audio technology, White goods, Home care products, Mobile communications, Gaming, Air care products, Home medical devices, Fitness devices, Home automation & networking devices, Consumer solar technology, Home theater, Digital imaging, In-vehicle technology, Wireless technology, Cable & satellite technology, Home security, Domestic lighting, Human interface, Artificial intelligence, Home computing, Video Technology, Consumer storage technology. Studies or opinion pieces on the societal impacts of consumer electronics are also welcome.  

Articles should be broadly scoped – typically review and tutorial articles are suited to the Magazine. Technical articles may be suitable but these should be of general interest to an engineering audience and of broader scope than archival technical papers. Authors need to target a broad engineering audience - specialized technical papers are generally too narrow in scope for IEEE magazine and should be submitted to the IEEE Transactions. Articles related to the background story behind engineering standards or practical experiences in product specification and design of mainstream consumer systems/devices are particularly welcome. Tutorials on CE related technologies or techniques are also strongly encouraged. Blogs or similar personal content from a Website can be adapted into an article as long as the author owns the original copyright, or the content is covered by a Creative Commons license, or equivalent. Please discuss with the EiC in advance of submitting an article. IEEE Consumer Electronics Magazine topics include, but are not limited to, the followings:

  1. Application-Specific CE for Smart Cities (SMC)
  2. Audio/Video Systems and Signal Processing (AVS)
  3. Automotive CE Applications (CEA)
  4. Consumer Power and Energy (CPE)
  5. Consumer Systems for Healthcare and Wellbeing (CSH)
  6. Entertainment and Gaming (ENT)
  7. Human-Machine Interaction and User Experience (HMI)
  8. Internet of Things, Internet of Everywhere and Edge Computing (IOT)
  9. Machine learning, Deep learning and AI in CE (MDA)
  10. Quantum in Consumer Technology (QCT)
  11. Security and Privacy of CE Hardware and Software Systems (SPC)
  12. Sensors and Actuators (SEA)
  13. Smartphone and Mobile Device Technologies (MDT)
  14. Virtual Reality, Augmented Reality and Displays (VAR)
  15. Wireless and Network Technologies (WNT)

 

Special Section Call for Articles

 Digital Twins: The confluence 
of Virtual Reality with IoT (CfP)

 Emerging Blockchain Technologies 
for Consumer Electronics (CfP)

Security and Privacy-Aware
Emerging Computing (CfP) 

IEEE MCE SS Digital Twins The confluence of Virtual Reality with IoT closed IEEE MCE SS Emerging Blockchain Technologies for Consumer Electronics IEEE MCE SS Security and Privacy Aware Emerging Computing

 Articles Submission Due: 
June 30, 2022 (EXTENDED DEADLINE) closed

 Articles Submission Due: 
October 31, 2022

 Articles Submission Due: 
November 1, 2022

 

Author Guidelines

Submissions should follow IEEE MCE Template and should consist of the followings: (i) A manuscript of maximum 6-page length: A pdf of the complete manuscript layout with figures, tables placed within the text, and (ii) Source files: Text should be provided separately from photos and graphics and may be in LaTeX or Word format. High-resolution original photos and graphics (300 dpi) are required for the final submission. Images embedded in Word or Excel documents are not suitable; however, figures and graphics may be provided in a PowerPoint slide deck, with one figure/graphic per slide.

The authors must own the copyright on any images, photographs or graphics or have obtained explicit permission for use of all such material when a third party owns the copyright. Alternatively, copy left images and materials may be used once the relevant license terms are complied with, including citations to the original source/author. It is the responsibility of the author(s) to demonstrate such compliance and document the corresponding license agreements (a URL is sufficient) in notes accompanying the submitted article. The authors should include a PDF file with a suggested layout of the article. Figure captions must be provided and ideally figures/graphics should be cited in the text of the article.  

An IEEE copyright form will be required. The manuscripts need to be submitted online using the following URL: http://mc.manuscriptcentral.com/cemag. This ScholarOne site will automate the generation of a single submission document if the authors have the correct files prepared in advance.

  

Overlenght Page Charges:

Articles exceeding 6 pages during author proof will be charged at US$ 250 per page for extra pages beyond the first allowed 6 pages. Similarly, the first allowed pages for Regular Column articles and Letters to the Editor is 3 pages, and for News items 2 pages. 

 

Editorial Board

 

Editor-in-Chief

 

Herencsar Norbert
Norbert Herencsar (R8)
Brno University of Technology, Czech Republic
Email:ieee.mce.eic@gmail.comherencsn@ieee.org

 

Senior Associate Editors

       
Cheng Wen Huang Choo Kim Kwang Raymond El Saddik Abdulmotaleb Sabella Dario
Wen-Huang Cheng
(R10)
‪Kim-Kwang Raymond Choo
(R5)
Abdulmotaleb El Saddik
(R7)
Dario Sabella
(R8)
National Yang Ming Chiao
Tung University, Taiwan
The University of Texas
at San Antonio, USA
University of Ottawa,
Canada
Intel Corporation,
Italy
       
Associate Editors 
       
Chamola Vinay Chen Yen Lin Dev Kapal Dong Haiwei
Vinay Chamola (R10) Yen-Lin Chen (R10) Kapal Dev (R8) Haiwei Dong (R7)
Birla Institute of Technology
and Science - Pilani, India
National Taipei University
of Technology, Taiwan
Munster Technological
University, Ireland
Huawei Technologies,
Canada
       
Farouk Ahmed Fu Jianlong Gai Keke Grois Dan
Ahmed Farouk (R7) Jianlong Fu (R10) Keke Gai (R10) Dan Grois (R8)
Wilfrid Laurier University,
Canada;
South Valley University,
Egypt
Microsoft Research,
China
Beijing Institute of
Technology, China
Comcast Corporation,
Israel
       
Hsiung Pao Ann Lamberti Fabrizio Lucena Jr Lv Zhihan
Pao-Ann Hsiung (R10) Fabrizio Lamberti (R8) Vicente F. Lucena Jr (R9) Zhihan Lv (R8)
National Chung Cheng
University, Taiwan
Politecnico di Torino,
Italy
Federal University of
Amazonas, Brazil
Uppsala University,
Sweden
       
Morra Lia Moustafa Hassnaa Mung Wai Yin Steve Pandi Vijayakumar
Lia Morra (R8) Hassnaa Moustafa (R3) Wai Yin, Steve Mung (R10)  Vijayakumar Pandi (R10)
Politecnico di Torino,
Italy
Intel Corporation,
USA
The Education University of Hong Kong,
Hong Kong
Anna University,
India
       
Pepa Lucia  Pescador Fernando Shojafar Mohammad Shu Lei
Lucia Pepa (R8) Fernando Pescador (R8) Mohammad Shojafar (R8) Lei Shu (R10)
Politecnica delle
Marche University, Italy
Universidad Politécnica
de Madrid, Spain
University of Surrey,
United Kingdom
University of Lincoln, 
United Kingdom; 
Nanjing Agricultural
University, China
       
Smith Ned Sookhak Mehdi Sotelo Rafael  Velikic Gordana
Ned Smith (R6) Mehdi Sookhak (R5) Rafael Sotelo (R9) Gordana Velikic (R8)
Intel Corporation,
United States
Texas AM University-
Corpus Christi,
United States
Quantum-South & Universidad
de Montevideo, Uruguay
Vincula Biotech,
Republic of Serbia
       
Yan Zheng  Yu Chia Mu Zhang Qingxue   
Zheng Yan (R10) Chia-Mu Yu (R10)  Qingxue Zhang (R4)   
Xidian University,
China
National Yang Ming Chiao
Tung University, Taiwan 
 Indiana University-Purdue
University Indianapolis, USA
 
       
Columnists
       
  Frankston Bob Mattioli Michael  
  Bob Frankston Michael Mattioli  
  Frankston.com, USA Goldman Sachs & Co., USA  
       
 
       

 

Past Editors-in-Chief

 
Yamaguchi Shingo Mohanty SarajuP Corcoran Peter
11/2021 - 12/2021 ‪7/2016 - 10/2021 1/2012 - 6/2016
Shingo Yamaguchi Saraju P. Mohanty Peter Corcoran
Yamaguchi University, 
Japan
University of North Texas, 
USA
National University of Ireland,
Galway, Ireland
 

 

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